Micron's $7 Billion Bet on AI-Driven Memory In Singapore Facility Set to Boost Innovation

On Wednesday, Micron Technology, Inc. MU broke ground on a new High-Bandwidth Memory (HBM) advanced packaging facility near the company’s current facilities in Singapore.

It marks Singapore’s first HBM advanced packaging facility, which will be highly automated through AI-based intelligent solutions and feature greenhouse gas abatement technologies.

Gan Kim Yong, Deputy Prime Minister and Minister for Trade and Industry of Singapore, Png Cheong Boon, Singapore Economic Development Board Chairman, and other officials attended the ceremony.

Also Read: Huawei And Baidu Increase Samsung HBM Purchases As US Curbs Loom

Operations for the new facility will begin in 2026, and Micron’s total advanced packaging capacity will expand starting in 2027.

Micron CEO Sanjay Mehrotra flagged that as AI adoption across industries increases, the demand for advanced memory and storage solutions will continue to increase robustly.

Micron’s HBM advanced packaging investment of ~$7 billion (SG $9.5 billion) through the end of the decade and beyond will initially create around 1,400 jobs.

Site expansion plans to reach an estimated 3,000 jobs, including functions like packaging development, assembly, and test operations.

Micron’s future expansion plans in Singapore will also support NAND’s long-term manufacturing requirement.

Nvidia Corp NVDA chief Jensen Huang announced at CES 2025 that Micron’s HBM chips will power Nvidia’s latest Blackwell architecture. Nvidia also showcased a $3,000 computer, dubbed Project Digits, featuring Micron’s DDR5X HBM.

Rosenblatt is one of Rosenblatt’s top picks for 2025, backed by HBM dominance and driving AI and memory cycles.

Prior reports indicated that SK Hynix will lead the HBM market in 2024, holding over 52% of the market share, followed by Samsung with 42.4% and Micron with over 5%.

Nvidia approved Samsung’s fifth-gen HBM3E chips for AI processors, while the 12-layer HBM3E chips are awaiting approval. Morgan Stanley expects the HBM market to grow from $4 billion in 2023 to $71 billion in 2027.

Micron is eying HBM chip production in the U.S. and Malaysia.

Micron stock surged 20% in the last 12 months. Investors can gain exposure to the stock through JPMorgan Equity Premium Income ETF JEPI and First Trust NASDAQ-100-Technology Sector Index Fund QTEC.

Price Action: MU stock traded higher by 1.36% to $103.30 premarket at the last check on Wednesday.

Also Read:

• TSMC Analyst Sees AI, Advanced Nodes Driving Growth In 2025

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