Qualcomm, TDK Form JV to Provide RF Front-End Solutions for Mobile Devices

Qualcomm Incorporated QCOM and TDK Corporation TTDKY today announced an agreement to form a joint venture to enable delivery of RF front-end (RFFE) modules and RF filters into fully integrated systems for mobile devices and fast-growing business segments, such as Internet of Things (IoT), drones, robotics, automotive applications and more, under the name RF360 Holdings Singapore PTE. Ltd. (RF360 Holdings)[1]. The joint venture will draw upon TDK's capabilities in micro-acoustic RF filtering, packaging and module integration technologies and Qualcomm's[2] expertise in advanced wireless technologies to serve customers with leading-edge RF solutions into fully integrated systems.   In addition to creating RF360 Holdings, Qualcomm and TDK will expand their collaboration around key technology fields, including sensors and wireless charging. The agreement is subject to receipt of regulatory approvals and other closing conditions and is expected to close by early 2017. "TDK is a leading electronic components manufacturer with cutting-edge expertise in RF filters and modules, and we are looking forward to deepening our collaboration and together accelerating innovation and better serving the ecosystem for next-generation mobile communications," said Steve Mollenkopf, CEO of See full press release