MEMC Resumes Wafer Production in Japan

MEMC Electronic Materials, Inc. WFR today announced that it has resumed production of 300mm wafers at its facility in Utsunomiya, Japan following the earthquake that occurred on March 11. The facility has been shipping unaffected product and has resumed production on qualified process tools, while continuing to inspect, qualify, and ramp additional equipment. Production yield on operating tools has been comparable to pre-earthquake levels, raw material availability has been good, and power availability has improved. Full 300mm production is targeted to be achieved by the middle of May. The facility's small volume of 200mm wafer capacity, previously scheduled to be moved to the company's Ipoh, Malaysia site during the third quarter of 2011, is now in the process of being moved ahead of the original schedule.