Eliyan Delivers Industry's Highest Performing Chiplet Interconnect PHY at 64Gbps in 3nm Process

SANTA CLARA, Calif. –October 9, 2024 – Eliyan Corporation, credited for the invention of the semiconductor industry's highest-performance and most efficient chiplet interconnect, today revealed the successful delivery of first silicon for its NuLink™-2.0 PHY, manufactured in a 3nm process. The device achieves 64Gbps/bump, the industry's highest performance for a die-to-die PHY solution for multi-die architectures. While compatible with UCIe standard, the milestone further confirms Eliyan's ability to extend die-to-die connectivity by 2x higher bandwidth, on standard as well as advanced packaging, at unprecedented power, area, and latency.

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Key Takeaways:

Record-Breaking Chiplet Interconnect: Eliyan's NuLink™-2.0PHY, manufactured in a 3nm process, delivers 64Gbps per bump, the highest performance for die-to-die PHY solutions, doubling bandwidth.
Enhanced Efficiency and Flexibility: The NuLink-2.0 PHY supports standard and advanced packaging and improves Die-to-Memory bandwidth by over 2x using UMI technology, with applications in AI, HPC, and gaming, reducing power and area requirements.
Cost-Effective Scalability & Sustainability: The solution enables high-performance multi-die architectures at lower power and lower costs, making it suitable for various markets, including aerospace, automotive, and industrial applications.

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About Eliyan

Eliyan Corporation is leading the chiplet revolution, focusing on a fundamental challenge with scaling semiconductor performance, size, power, and cost to meet the needs of high-performance computing applications. It has developed a breakthrough technology to enable the industry's highest performing chiplet interconnect for homogenous and heterogenous multi-die architectures using either standard or advanced packaging, enabling increased sustainability through reduction in costs, manufacturing waste and power consumption. More information can be found here: www.eliyan.com

Contacts:

Mike Sottak
1 (650) 248-9597
mike@wiredislandpr.com

Source: Eliyan

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Eliyan Delivers Industry's Highest Performing Chiplet Interconnect PHY at 64Gbps in 3nm Process