Lam Research Acquires SEMSYSCO Enabling Better HPC, AI Solutions

Lam Research Corp LRCX completed the acquisition of SEMSYSCO GmbH, a global provider of wet processing semiconductor equipment, from Gruenwald Equity and other investors. The financial terms of the transaction remain undisclosed.
With the addition of SEMSYSCO, Lam gains capabilities in advanced packaging, ideal for leading-edge logic chips and chiplet-based solutions for high-performance computing (HPC), artificial intelligence (AI), and other data-intensive applications.
Also Read: China-Related Headwinds Force Chip Analyst To Slash Expectations on Lam Research, Applied Materials
The acquisition of SEMSYSCO broadens Lam's packaging offerings, bringing a portfolio of innovative cleaning and plating capabilities for chiplet-to-chiplet or chiplet-to-substrate heterogeneous integration.
"New substrate-based panel-level approaches are vital to cost-effectively realizing the high-performance chiplet-based solutions needed for the digital world," said Keyvan Esfarjani, chief global operations officer at Intel Corp INTC. "We are pleased to expand our deep, long-standing relationship with Lam to include advanced cleaning and plating processes in the new panel form factor."
Tim Archer, CEO at Lam Research, said, "With innovative offerings and leading-edge research and development in packaging, Lam is well-positioned to support our customers as they scale to future chiplet-based technologies."
With the acquisition of SEMSYSCO, Lam also gains a state-of-the-art R&D facility in Austria focused on next-generation substrates and heterogeneous packaging, broadening the company's strong development capabilities in Europe and adding a sixth lab in Lam's global network.
Lam Research held $4.6 billion in cash and equivalents as of September 30.
Price Action: LRCX shares traded higher by 1.24% at $486.65 on the last check Tuesday.

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