Chinese EV Innovations: NIO And XPeng Advance In-House Smart Driving Chips, Tape-Out Progress And Future Prospects Unveiled

NIO Inc. NIO and XPeng Inc. XPEV have reportedly completed the design phase of their internally developed smart driving chips, signaling their imminent integration into production vehicles.

This marks the next phase towards integrating these chips into production vehicles, CnEV Post reported, citing local media.

At Nio Day 2023 on December 23, Nio introduced its inaugural in-house autonomous driving chip, the Shenji NX9031, crafted using a cutting-edge 5 nm manufacturing process.

Also Read: Xpeng Follows Tesla’s Lead? Reportedly Ditches LiDAR In New Model F57 For Pure Vision Driving

The Shenji NX9031 chip will power Nio’s ET9 executive flagship sedan, currently open for pre-orders with deliveries scheduled to commence in the first quarter of 2025.

The Shenji NX9031 chip has completed the tape-out process and is currently undergoing testing.

According to the report, “taping out” marks the transition of a chip from design to manufacturing, a pivotal step in its journey toward mass production and commercialization.

Xpeng’s in-house smart driving chip is already in the taping out phase and is expected to yield initial pilot production results by August.

Li Auto Inc LI is also progressing with its chip project under the codename “Schumacher,” which commenced later than Nio and Xpeng but is slated to tape out within the year, the report read.

Nio’s announcement of the NX9031 highlighted the chip’s impressive specifications, boasting over 50 billion transistors and performance on par with four NVIDIA Corporation NVDA Drive Orin X chips, per the report.

Nio’s current NT 2.0 platform-based models are equipped with four Orin X chips, delivering a total computing power of 1,016 Tops.

Price Action: NIO shares are trading higher by 0.22% to $4.47 at last check Tuesday.

Disclaimer: This content was partially produced with the help of AI tools and was reviewed and published by Benzinga editors.

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