- Intel Corp INTC will invest 30 billion ringgit ($7 billion) in expanding its manufacturing capabilities in advanced semiconductor packaging technology in Penang, Malaysia, Bloomberg reports.
- The addition of advanced packaging capabilities to Intel’s operations in Malaysia will amplify its supporting activities and global service center.
- Intel CEO Patrick Paul Gelsinger, Malaysia’s Trade Minister Azmin Ali, and Malaysian Investment Development Authority CEO Arham Abdul Rahman will attend a press conference on investment on December 15 at the Kuala Lumpur International Airport.
- The investment will position Malaysia as critical manufacturing and shared services hub.
- Price Action: INTC shares traded higher by 0.43% at $50.81 in the premarket session on the last check Monday.
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