Ericsson Partners with Intel to Leverage Advanced 5G Infrastructure Technology

Ericsson ERIC tapped Intel Corp INTC to leverage Intel's 18A process and manufacturing technology for Ericsson's future next-generation optimized 5G infrastructure.

Intel will manufacture custom 5G SoCs (system-on-chip) for Ericsson to create highly differentiated leadership products for future 5G infrastructure. 

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Additionally, the companies will expand their collaboration to optimize 4th Gen Intel Xeon Scalable processors with Intel vRAN Boost for Ericsson's Cloud RAN (radio access network) solutions.

18A is Intel's most advanced node on the company's five-nodes-in-four-years roadmap. After new gate-all-around transistor architecture – known as RibbonFET – and backside power delivery – called PowerVia – appear first in Intel 20A, Intel will deliver ribbon architecture innovation and increased performance along with continued metal linewidth reduction in 18A. The technologies will put Intel back in the process leadership position in 2025, elevating future offerings its customers bring to market.

In July, Ericsson reported sales growth of 3% year-on-year to SEK 64.4 billion ($6.125) billion, in line with the consensus of $6.130 billion.

The sharp decline in sales in North America was partly offset by solid sales development in India. In Networks, Ericsson saw strong execution with record build-out speed in India, which now has a leading market share. 

It reported an EPS loss of SEK (0.21) versus SEK 1.35 last year. Adjusted EPS of $0.07 beat the consensus of $0.04.

Price Action: INTC shares traded lower by 1.14% at $33.71 premarket on the last check Wednesday.

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