ASE Technology Breaks Ground On New Chip Facility In Malaysia

ASE Technology Holding Co, Ltd ASX hosted a groundbreaking ceremony today to construct a new semiconductor assembly and testing facility in Penang, Malaysia.
The new facility at ASE Malaysia (ASEM) will comprise two buildings (Plants 4 and 5) with a built-up area of 982,000 square feet, located in the Bayan Lepas Free Industrial Zone.
ASEM will invest $300 million over five years to expand its production floor space, procure advanced equipment, and train and develop more engineering talent.
Also Read: Samsung Breaks Ground On R&D Complex in Giheung, Korea
The new facility will likely complete in 2025, creating 2,700 additional job opportunities for the local market.
Together with Plants 4 and 5, ASEM will have 2 million square feet of floor space, representing a two-fold increase from the current floor space.
High-demand packaging product types, including copper clip and image sensors, will be the core focus of the new facility.
Green construction methods that emphasize ecological balance, conservation, and resource recycling and reuse will be adopted for the new building.
ASEM will also be actively recruiting in the new year and beyond to strengthen its workforce base and contribute to the growth of semiconductor talent in Penang.
ASE reported a 25% year-on-year net revenue growth in Q3 to NT$188.63 billion.
Net revenues for ATM (assembly, testing, and material) business was NT$98.8 billion, up 10% Y/Y and 4% Q/Q.
EMS (electronic manufacturing services) net revenues were NT$90.66 billion, up 37% Q/Q.
Price Action: ASX shares traded higher by 7.89% at $5.95 on the last check Thursday.

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