Intel CEO Stresses Role in AI Boom, Taking on Nvidia in Accelerator Tech at Innovation Conference

During the annual Innovation conference, Intel Corp's INTC CEO, Pat Gelsinger, emphasized the significance of Intel's technology in the burgeoning artificial intelligence (AI) computing industry. 

Gelsinger highlighted Intel's advancements in production technology and software developer tools for AI, asserting that AI represents a generational shift with vast societal and business opportunities. 

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He believes that AI's impact will extend beyond data centers to areas like personal computers, revitalizing the PC market, Bloomberg reports.

Intel aims to revitalize its technology and regain its position as an industry leader. Gelsinger pledged to accelerate manufacturing technology upgrades, with Intel 3, a new chipmaking technique, set to debut by year-end. 

While Intel faced challenges in manufacturing, rivals like Taiwan Semiconductor Manufacturing Co TSM and Nvidia Corp NVDA surged ahead in AI acceleration technology. Nevertheless, Gelsinger noted that Intel has made progress in its accelerator efforts, particularly with the Gaudi2 product line.

One significant development is the introduction of Intel Core Ultra processors with integrated "neural processing units" to enhance AI software performance in PCs. 

These processors will be available in computers starting in December. Additionally, Intel is opening its factory network to external customers, even competitors, through its foundry business initiative, contingent on Intel showcasing cutting-edge manufacturing by 2025.

Intel also provides software developers early access to its upcoming products through the Intel Developer Cloud. 

This service allows users to test their workloads on Intel-hosted computers over the internet, enabling developers to optimize their projects for Intel chips when they become widely available.

Recently, Cadence Design Systems, Inc CDNS CEO Anirudh Devgan flagged the importance of semiconductor packaging to help companies like Nvidia accomplish their AI ambitions. 

TSMC leads in advanced chip packaging patents, followed by Samsung Electronics Co, Ltd SSNLF and Intel.

Price Action: INTC shares traded higher by 0.22% at $36.42 premarket on the last check Wednesday.

Disclaimer: This content was partially produced with the help of AI tools and was reviewed and published by Benzinga editors.