- Laser Photonics and CMS Laser advance UV laser tech for microelectronics and medical devices.
- New PCB depaneling system enables precise, non-charring circuit board separation.
- Geopolitical tensions, Fed uncertainty, and fast-moving headlines are driving July volatility. See how Chris Capre is trading it—live Wednesday, July 2 at 6 PM ET.
On Thursday, Laser Photonics Corporation LASE and its subsidiary, Control Micro Systems (CMS Laser), announced the launch of an accelerated R&D initiative.
The initiative is aimed at enhancing UV laser cutting and marking systems for microelectronics and medical device manufacturers.
CMS Laser’s advanced UV laser-powered PCB Depaneling system ensures precise, non-charring separation of small printed circuit boards with tight tolerances.
Beyond UV lasers, CMS Laser customizes systems using fiber, CO2, and ultra-short pulse lasers. Clients can test materials in its applications lab, with specialists guiding them to optimal solutions.
John Armstrong, Executive Vice President of LPC, said, “Collaborating closely with CMS Laser, Laser Photonics is advancing the research and development of high-precision material processing with UV lasers for the microelectronics and medical industries.”
“These high-value laser solutions expand our broad range of capabilities and applications, delivering even greater value to our clients and shareholders.”
This week, the company received a significant order from Rocket Lab USA, Inc., a provider of space systems and launch services.
Price Action: LASE shares are down 1.16% at $3.40 at the last check Thursday.
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