Applied Materials AMAT today launched its new Applied Centura Tetra X Advanced Reticle Etch system.
It's touted as the only system capable of etching the photomasks needed for customers' most challenging device layers at 22nm and beyond.
Expanding the capabilities of Applied's industry-standard Tetra III platform, the Tetra X breaks the 2nm critical dimension uniformity barrier across all feature sizes – delivering the critical mask accuracy that can enable mask makers to exceed their customers' strictest pattern-to-specification requirements for all device types.
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