Apple Inc. AAPL officially released its new iPhone SE on Thursday, and Chipworks has already performed a preliminary teardown of the gadget.
Following the launch, Raymond James analysts J. Steven Smigie and Vincent Celentano shared some initial assessments, focused on parts of the phone that come from companies in the firm’s coverage universe.
Teardown: Positive Surprise For Skyworks
The experts at Chipworks could identify a few RF components. Among them was Skyworks Solutions Inc SWKS’s SKY77611 power amplifier module. This is seen as a positive for the company, since the analysts had previously conceived its tone regarding content on the SE as “cautious.”
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Another part identified was the EPCOS D5255 antenna switch module, which likely now falls under the QUALCOMM, Inc. QCOM - TDK joint venture.
Other components of the iPhone SE included:
- Broadcom Ltd AVGO’s BCM5976 touch screen controller.
- NXP Semiconductors NV NXPI’s NFC and secure element.
- Texas Instruments Incorporated TXN’s power management IC and touch screen controller.
Of note, Analog Devices, Inc. ADI was left out of the list. “As expected, the iPhone SE did not contain 3D Touch. We expect ADI will have its force touch technology on the iPhone 7,” the report added.
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